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Heat Sink & Junction Temperature Calculator

Junction, case and heat-sink temperatures from power and thermal resistances, the heat sink a part needs or the power it can shed, with regulator loss.

Accepts decimal commas; currents accept 0.5, 500 mA or 5 mA (no unit means A). °C/W equals K/W.

Power dissipated
Junction temperature
Case temperature
Heat-sink temperature
Total θ junction–air
Margin to max

Regulator loss is (Vin − Vout) × load current + Vin × quiescent current.

Steady-state model: thermal resistances in series from junction to air, no thermal capacitance.

How to use

  1. Pick what to find: junction temperature, the heat sink needed, or the maximum power.
  2. Enter the power directly, or the regulator's input and output voltage, load current and quiescent current; then the ambient temperature, the maximum junction temperature and the thermal resistances from the datasheets.
  3. Read the temperatures and margin, the largest θSA to shop for, or the power limit; switch to No heat sink to use the datasheet's θJA instead.

About this tool

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Works out how hot a semiconductor runs and what it takes to keep it cool. Heat leaves the silicon through a chain of thermal resistances — junction to case (θJC), case to heat sink through the interface material (θCS) and heat sink to air (θSA) — and each one raises the temperature by the power times its value in °C/W, exactly as current through a resistor raises the voltage. The junction therefore sits at the ambient temperature plus the power times the sum of the chain.

The tool works that chain three ways. Given the heat sink, it returns the junction, case and heat-sink temperatures and the margin to the part's maximum junction temperature. Given the maximum junction temperature, it returns the largest θSA a heat sink may have, which is the number to look for in a heat-sink catalogue — the lower, the bigger the sink. Given all the resistances, it returns the most power the part can dissipate. Without a heat sink the whole chain collapses into the single θJA figure from the datasheet.

Power can be entered directly or worked out for a linear regulator, where everything not delivered to the load becomes heat: (Vin − Vout) × load current, plus the quiescent current drawn from Vin. A 7805 dropping 12 V to 5 V at 0.5 A with 5 mA of quiescent current dissipates about 3.56 W. In a TO-220 package with no heat sink (θJA around 50 °C/W) at 40 °C ambient the junction would try to reach about 218 °C, far past its limit; with θJC = 5, a 0.5 °C/W pad of thermal compound and a 10 °C/W heat sink it settles near 95 °C. That is why a switching regulator is usually the better answer for large voltage drops.

The figures are steady-state: they describe the temperature after the part has warmed up, not a short burst, where the thermal capacitance of the case and heat sink absorbs heat for a while. θJA in datasheets is measured on a standard test board, so a small board, an enclosed box or still air can make it much worse. θSA of a heat sink also depends on airflow and on its orientation, and interface resistance depends on the material, the pressure and the flatness of the surfaces. Leave a margin of 10–20 °C below the rated maximum, which is typically 125 °C or 150 °C for silicon; °C/W and K/W are the same unit. Everything runs in your browser.

Frequently asked questions

What is θSA and how do I pick a heat sink with it?

It is the heat sink's thermal resistance to the surrounding air, in °C/W, and catalogues list it for each sink. The tool's 'heat sink needed' mode gives the largest value that keeps the junction under its limit; choose a sink with a lower θSA than that, remembering that catalogue figures often assume some airflow.

Why does a linear regulator get so hot?

Because it burns the whole voltage difference as heat. Dropping 12 V to 5 V at 0.5 A turns 3.5 W into heat while delivering 2.5 W to the load — more than half the input power is wasted. A buck converter would lose only a fraction of a watt.

What should I enter for θCS?

The thermal resistance of the interface between the case and the heat sink. For a TO-220 it is typically 0.1–0.5 °C/W with thermal compound, 0.5–1 °C/W with a silicone pad, and 1–2 °C/W or more if the surfaces are dry or an insulating washer is used.

Is the no-heat-sink θJA from the datasheet reliable?

Only as a comparison figure. It is measured on a standardised test board (JEDEC) in still air, and a real board with less copper, other hot parts nearby or an enclosure can be much worse. For surface-mount parts, copper area on the board acts as the heat sink.

What maximum junction temperature should I use?

The absolute maximum from the datasheet, often 125 °C or 150 °C, is where the part may be damaged or shut down. Design for 10–20 °C below it, because lifetime falls quickly with temperature and ambient conditions vary.

Does it handle short power pulses?

No. The results are steady-state temperatures. A short pulse heats the junction less, because the package and heat sink store heat for a while; datasheets give a transient thermal impedance curve for that case.

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